boot.img and init_boot.img get their build properties from the platform
ramdisk properties.
Test: "m dist" then drop the OTA zip file into
android.github.io/analyseOTA to verify init_boot is present.
Bug: 211823573
Change-Id: I411e62bf0fc3cb49d4b12dadb52d9820fca041fa
zip -d doesn't work when no entry names specified. So if the list of
entry is empty, just skip calling zip -d.
Bug: 218438888
Test: th
Change-Id: Ie4419b9d6fdc2780255c6f12f9f4d35e5c0a7b26
Bug: 200082547
Test: Manual builds:
1. Set BOARD_USES_SYSTEM_DLKM_PARTITION
2. Set BOARD_PREBUILT_SYSTEM_DLKM_IMAGE to external image
- Check that "m dist" put the system_dlkm image in
out/dist/aosp_cf_x86_64_phone-img-eng.ramjiyani.zip
Signed-off-by: Ramji Jiyani <ramjiyani@google.com>
Change-Id: I8b7dd40e178db7fe542253bff19040095847fa57
Thin manifests (e.g. master-art) may not have the aapt2 sources and
instead relies on the prebuilt in prebuilts/sdk/tools/linux/bin. In
that case there's no aapt2 in the search path, so it needs to be
specified.
Test: Heavy presubmit build on mainline_modules_bundles on git_master
Test: vendor/google/modules/ArtGoogle/build-art-module.sh
with http://ag/16584845 on git_master-art, where only the prebuilt
aapt2 is present
Bug: 212462945
Change-Id: I41a22e8146f5a88534c2721345b4d9d64f76698c
If init_boot.img is present, the GKI boot-*.img should
not include the ramdisk because the ramdisk will be packed
into the init_boot.img instead.
The "has_ramdisk" flag incorrectly checks the condition of:
prebuilt_name != "boot.img" to see if it is a boot.img.
Because "has_ramdisk" was added before we packed multiple
GKI boot-*.img, e.g., boot-5.10.img, boot-5.10-lz4.img, etc.,
into the target files.
Fix this by checking the partition_name is "boot" or not.
Also moving the logic into a new function with comments for each
condition.
Bug: 203698939
Bug: 213028932
Test: sign_target_files_apks \
--gki_signing_key=external/avb/test/data/testkey_rsa4096.pem \
--gki_signing_algorithm=SHA256_RSA4096 \
./out/dist/*-target_files-eng.*.zip signed.zip, then
unpack_bootimg to checks the signed boot-*.img has no ramdisk
Change-Id: I5354669feb54d547dbe797e51b1b1baa187cb7cf
This new init_boot.img contains the ramdisk that used to reside in the
boot.img file.
Test: set BOARD_PREBUILT_INIT_BOOT_IMAGE to an external init_boot.img
- Check that "m" pulls in the init_boot.img to
out/target/product/vsoc_x86_64/
- Check that "m dist" adds the init_boot.img to
aosp_cf_x86_64_phone-img-eng.devinmoore.zip
Test: atest --host releasetools_test
Bug: 203698939
Change-Id: If7ef2cf093e5e525529c7c44333c0f40f6ba0764
location of ota_from_target_files changed from
out/host/linux-x86/bin to
out/soong/host/linux-x86/bin . This changes relative position of
signapj.jar. To fix, use ANDROID_HOST_OUT as search path
Change-Id: I5397171566e9d7598b5ef16ae26641f0c183d748
- Sort dictionaries before looping over them
- Don't call sorted() on lists with Nones
- Open file in binary format when serializing protobufs
Change-Id: If5dbc908f7125f6184014b3c1c7891f833d1d8bf
Bug: 203436762
Test: Presubmits
Pixel moved away from sparse images, so validate_target_files is failing
because it expects sparse images.
Test: th
Change-Id: I322ff10c2afbacfb4d78991be60c11aac92a6d4c
When an APEX specifies its custom signing tool (custom_sign_tool:),
apexkeys.txt contains the info and sign_target_files_apks pass the value
to apex_util.
For now the Virt APEX has its own custom signing tool (sign_virt_apex),
which is added to OTATOOLS.
Bug: 193504286
Test: sign_target_files_apks invokes sign_virt_apex
Change-Id: Iba845723fe3e18f542963324b9c58cd00914c5ba
When we introduced Dynamic Partitions, we stopped giving readonly
partitions fixed sizes. In addition we introduced deduplication for
ext4. These two factors greatly reduce the impact of sparse images,
since there aren't many fill blocks to optimize.
This patch disables sparsing for images that are rightsized and do not
explicitly specify extra reserved space. This makes the images a little
easier to work with from an engineering perspective. They no longer have
to be unsparsed to interact with any tooling. It also eases a potential
source of bugs, as b/184225422 is not reproducible with sparsing off.
On Pixel, the difference between the sparsed partitions and unsparsed is
12M (out of roughly 4G).
Bug: 198001223
Test: make, treehugger, make target-files-package
dynamic partitions are no longer sparse images
Change-Id: I74459f8abe74a15a24ba5a40cf701e6af2db8179
This prop is owned by OEM, OEM can set this if they want to disable
VABC.
Test: m dist, make sure generated OTA has VABC disabled
Bug: 185400304
Change-Id: Iceb2fb1f399d38a51722352a86ddf68af05fa24e
When generating a partial OTA, filter care_map.pb to include only the
partial partitions, then generate OTA.
Test: Generate a partial OTA, make sure care map is included.
Change-Id: I0eaa12772eb1d06a57451e64f70689d3183f0115
Devices using GKI architecture will use a prebuilt boot.img.
However, we should still sign this prebuilt boot.img with
device-specific AVB keys.
Steps to test the CL.
1. In a device BoardConfig.mk:
# Uses a prebuilt boot.img
TARGET_NO_KERNEL := true
BOARD_PREBUILT_BOOTIMAGE := device/google/redbull/boot.img
# Enable chained vbmeta for the boot image.
# The following can be absent, where the hash descriptor of the
# 'boot' partition will be stored then signed in vbmeta.img instead.
BOARD_AVB_BOOT_KEY_PATH := external/avb/test/data/testkey_rsa4096.pem
BOARD_AVB_BOOT_ALGORITHM := SHA256_RSA4096
BOARD_AVB_BOOT_ROLLBACK_INDEX := $(PLATFORM_SECURITY_PATCH_TIMESTAMP)
BOARD_AVB_BOOT_ROLLBACK_INDEX_LOCATION := 2
2. `make bootimage`, then `avbtool info_image --image $OUT/boot.img`,
checks the image is re-signed with a device-specific key
3. `make dist` to generate out/dist/TF.zip
4. `unzip out/dist/TF.zip IMAGES/boot.img`
5. `avbtool info_image --image out/dist/IMAGES/boot.img`,
checks the image is re-signed with a device-specific key
6. `sign_target_files_apks \
--avb_boot_key=external/avb/test/data/testkey_rsa8192.pem \
--avb_boot_algorithm=SHA256_RSA8192 \
--avb_boot_extra_args="--prop test:sign" \
./out/dist/*-target_files-eng.*.zip signed.zip`, resign the TF.zip
7. `unzip signed.zip IMAGES/boot.img`, then use `avbtool info_image` to
check the boot.img is re-signed with the --avb_boot_key in step 6.
Bug: 188485657
Test: above steps
Change-Id: I7ee8b3ffe6a86aaca34bbb7a8898a97b3f8bd801
If the build prop ro.build.id isn't set at build time, init will
set it at runtime. The logic is appending the vbmeta digest to
the ro.build.legacy.id.
Make the same change in ota scripts, so the correct build fingerprint
will be saved in the ota metadata.
Bug: 186786987
Test: generate an OTA, check the metadata
Change-Id: I278f59c41c1f98d4cbea749e5d9e4eaf7a6b9565
If source supports VABC, delta_generator/update_engine will attempt to
use VABC. This dangerous, as the target build won't have snapuserd to
serve I/O request when device boots. Therefore, disable VABC if source
build doesn't supports it.
Test: downgrade from VABC enabled build to a build w/o VABC
Change-Id: Ie8353e00f65354c2242ee5255b6652c6b62483a4
RamdiskFormat class is introduced by commit : f3f842b676
But it seems _MakeRamdisk() related codes are also needed, then
both of the code style are same.
This patch takes below 2 changes:
1) adds new commom function _GetRamdiskFormat()
2) unfiy the code logic of _MakeRamdisk() and its related code logic.
Change-Id: Ibd4932a6050fbac15fcd741c70dd7854c12e887d
Signed-off-by: jiajia tang <tangjiajia@xiaomi.com>
This change intends to fix if ramdisk is not "lz4" compression.
Legacy is "minigzip" compression.
If not lz4, the following error will happen when exec build_super_image.py:
Unable to get boot image build props: Failed to run command '['lz4', '-d', '/tmp/boot_omdZZ8.img/ramdisk', '/tmp/boot_omdZZ8.img/uncompressed_ramdisk']' (exit code 44):
Error 44 : Unrecognized header : file cannot be decoded
Change-Id: I71248387bbeecbf184e0c24e6346c235d728518e
Signed-off-by: jiajia tang <tangjiajia@xiaomi.com>
Commit I9967d06bde0e18a12b84b5b0b568db09765fe305 supports adding a
generic boot_signature into boot.img v4. This change allows replacing
the boot_signture signing key with a release key during the release
process.
The default GKI signing key can be specified in a BoardConfig.mk via:
BOARD_GKI_SIGNING_KEY_PATH := external/avb/test/data/testkey_rsa2048.pem
BOARD_GKI_SIGNING_ALGORITHM := SHA256_RSA2048
BOARD_GKI_SIGNING_SIGNATURE_ARGS := --prop foo:bar
The release signing key/algorithm can be specified by the following options
when invoking sign_target_files_apks:
--gki_signing_key=external/avb/test/data/testkey_rsa4096.pem
--gki_signing_algorithm=SHA256_RSA4096
Additional arguments for generating the GKI signature can be
specified as below:
--gki_signing_extra_args="--prop gki:prop1 --prop gki:prop2"
Bug: 177862434
Test: make dist
Test: sign_target_files_apks \
--gki_signing_key=external/avb/test/data/testkey_rsa4096.pem \
--gki_signing_algorithm=SHA256_RSA4096 \
--gki_signing_extra_args="--prop gki:prop1 --prop gki:prop2" \
./out/dist/*-target_files-eng.*.zip signed.zip
Test: Checks GKI boot_signature is expected after signing:
`unzip signed.zip IMAGES/boot.img`
`unpack_bootimg --boot_img IMAGES/boot.img --out unpack`
`avbtool info_image --image unpack/boot_signature`
Test: unit test: releasetools_test and releasetools_py3_test
Change-Id: I61dadbc242360e4cab3dc70295931b4a5b9422a9
Fail the signing if the AVB_FOOTER_ARGS_BY_PARTITION isn't in sync
with common.AVB_PARTITIONS.
Bug: 181787095
Test: run sign_target_files_apks on a S image
Change-Id: I6ccf5fb9f39b92c1da2554f5b3826d2cd87d84d7
Fix incorrect report "Failed to find the ZIP entry" error when
generate OTA package.
This happens when we have a file in ROOT which name contains 'system'
such as init.system_init.rc, and init.system_init.rc will be rename to
init.SYSTEM_init.rc incorrectly, so we failed to find the entry in ZIP.
Test: manual test
Change-Id: I97359e513aaca7521fe9c035f6a4264a2053b86d
Signed-off-by: wangshumin <wangshumin@xiaomi.com>
Gather all BOARD_BOOTCONFIG parameters.
Create vendor-bootconfig.img with parameters seperated by newlines. Pass
that file to mkbootimg as --vendor_bootconfig to add it to the
vendor_boot.img.
Test: Add BOARD_BOOTCONFIG parameters in cuttlefish .mk file
Check vendor-bootconfig.img for expected output
Verify expected vendor_boot.img format with:
unpack_bootimg --boot_image vendor_boot.img
Test: Update Cuttlefish bootloader to handle the new vendor_boot.img and
check /proc/bootconfig for the expexted parameters.
Bug: 173815685
Change-Id: Iaa9b71b4bc64375777a5353396e83bb2beb25c47
The pvmfw is included in an `m` build but not in the distribution files.
Apply the same treatment as the dtbo partition to copy the pvmfw
partition to dist/ since, similar to the dtbo image, the pvmfw image is
generally provided as a prebuilt image.
Test: make dist
Bug: 174457787
Change-Id: I6f42517ba42db92e90048d1236d7255ccbd73f73
This is needed due to output artifacts in the zip that confuse globbing,
such as [.
(Also changes this call to RunAndCheckOutput, which prints the stderror
by default instead of RunAndWait which does not. Removes RunAndWait
which is now unused)
Bug: 179799226
Test: Run merge_target_files to merge two partial builds
Change-Id: Ibf8a5b0c013c9cd8b1e61195d97583f247d97c6f
If system/etc/ramdisk/build.prop does not exist in the ramdisk,
GetBootImageBuildProp should return None instead of a path
to a non-existant file.
Test: pass
Bug: 177171706
Change-Id: I34e447bc315d203e136e8c0d59d00961f81301e3
Add boot to PARTITION_WITH_BUILD_PROP. Let PartitionBuildProps handle
boot partitions by extracting build.prop file.
Test: generate OTA and call
`payload_info.py payload.bin`, check that boot image timestamp is
set
Bug: 162623577
Change-Id: I71955e4ee494ffbb5d111c3d02a129c0f879b6d1
Right now they are the same content. In the future, boot will be added
to PARTITIONS_WITH_BUILD_PROP, but it is not added to
PARTITIONS_WITH_CARE_MAP. Boot partition has a cpio filesystem in the
ramdisk, so it contains a build.prop file, but it doesn't make sense to
create care map from it.
Test: TH
Bug: 162623577
Change-Id: I9b5a20fe2d774b52cf7d5eae9deecbc75122a3dd
Add support for partitioning the vendor_boot kernel modules into
multiple vendor ramdisk fragments. The partition granularity is kernel
module directory. This mechanism builds upon the existing
BOARD_KERNEL_MODULE_DIRS mechanism. For example, say we have three
kernel module directories:
BOARD_KERNEL_MODULE_DIRS := foo bar baz
We can then define a vendor ramdisk fragment:
BOARD_MKBOOTIMG_ARGS += --header_version 4
BOARD_VENDOR_RAMDISK_FRAGMENTS := dlkm_foobar
And let said ramdisk to contain the DLKM directories "foo" and "bar":
BOARD_VENDOR_RAMDISK_FRAGMENT.dlkm_foobar.KERNEL_MODULE_DIRS := foo bar
BOARD_VENDOR_RAMDISK_FRAGMENT.dlkm_foobar.MKBOOTIMG_ARGS := <mkbootimg args>
The built vendor_boot image would contain two ramdisks.
The first one being the "default" ramdisk, which contains DLKM directory
"baz" and the rest of the files that get's installed to
$(TARGET_VENDOR_RAMDISK_OUT).
The second one is the "dlkm_foobar" ramdisk, which contains the two DLKM
directories.
Design doc: go/vendor-boot-v4
Bug: 162864255
Test: Modify BoardConfig.mk to have a product build v4 vendor_boot
Test: Use unpack_bootimg to verify the vendor_boot image
Test: Teach a bootloader how to handle v4 boot image, flash boot &
vendor_boot and boot device
Change-Id: Ibb1bbd7ebe36430c55ec6c4818c1d3888a319089
