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Merge "Remove leading whitespace from dump-variables-rbc results" am: 1fabb2a942

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Original change: https://android-review.googlesource.com/c/platform/build/+/2162942

Change-Id: I20d01010d7d9f432b13506920ccdf6d849a9df59
Signed-off-by: Automerger Merge Worker <android-build-automerger-merge-worker@system.gserviceaccount.com>
This commit is contained in:
Cole Faust
2022-08-01 17:26:37 +00:00
committed by Automerger Merge Worker
parent 30c7aead84 1fabb2a942
commit b102b987a5
1 changed files with 4 additions and 1 deletions
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5
core/envsetup.mk
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@@ -323,7 +323,9 @@ endif
# likely to be relevant to the product or board configuration.
# Soong config variables are dumped as $(call soong_config_set) calls
# instead of the raw variable values, because mk2rbc can't read the
# raw ones.
# raw ones. There is a final sed command on the output file to
# remove leading spaces because I couldn't figure out how to remove
# them in pure make code.
define dump-variables-rbc
$(eval _dump_variables_rbc_excluded := \
BUILD_NUMBER \
@@ -345,6 +347,7 @@ $(v) := $(strip $($(v)))$(newline))\
$(foreach ns,$(sort $(SOONG_CONFIG_NAMESPACES)),\
$(foreach v,$(sort $(SOONG_CONFIG_$(ns))),\
$$(call soong_config_set,$(ns),$(v),$(SOONG_CONFIG_$(ns)_$(v)))$(newline))))
$(shell sed -i "s/^ *//g" $(1))
endef
# Read the product specs so we can get TARGET_DEVICE and other